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B.Cu" "Notes": "Layer B.Mask" "Notes": "Layer F.Mask" "Notes": "Layer B.Cu" "Notes": "Layer B.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.Cu" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.Mask" "Notes": "Layer B.Cu" "Notes": "Layer B.Paste" "Notes": "Layer F.Paste" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Thu Aug 12 15:59:21 2021 ac58a9eaed checkpoint after roughing out middle PCB ebf8c2dd87 Move LED resistors Checkpoint after re-centering sliders, before removing redundant LED resistors next to transistors to save on panel wires ttrss-plugin- _comics/init.php 511 lines label_font_size = 5; thickness=2; */ module label(string, size=4, halign="center", font="Futura XBlk BT:style=Extra Black") { //} // draw a "vertical" wall to mount the circuit board to, dead center wall(h=6, w=height-hole_dist_top*3-4); // color([1,0,0] // surface("FIREBALL VCO.png", center=true, invert=false); */ module panel(h) { width_mm = hp_mm(width); // where to put the output to allow faster previews. Influences segments for circles U = 44.45; // Horizontal pitch size (mm // Horizontal pitch size (mm // Horizontal pitch size (mm HP = 5.075; // 5.07 for a single 0.25 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xxx-DV-BE-LC, 41 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas WSON-6 DQK, http://www.ti.com/lit/ds/symlink/csd16301q2.pdf Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch.

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