Labels Milestones
Back1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x23, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x20, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x28 1.27mm double row Through hole angled socket strip THT 2x32 2.54mm double row Through hole straight pin socket, 2x20, 2.54mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x20, 2.54mm pitch, double rows Through hole angled pin header, 2x40, 1.27mm pitch, single row style1.
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