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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip SMD 1x13 1.00mm single row Through hole angled pin header, 2x33, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x11 1.00mm double row surface-mounted straight socket strip, 2x32, 2.00mm pitch, double rows Through hole IDC header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header THT 2x05 2.00mm double row Through hole straight pin header, 2x32, 2.00mm pitch, double rows Through hole angled pin header, 2x25, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x18 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x25 1.00mm single row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x15 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header SMD 2x37 1.27mm double row Through hole angled pin header, 2x22, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 1x22, 2.00mm pitch, 6.35mm socket length, single row style1 pin1.

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