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Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900.

• -0.0645513 -0.533418 0.843385 facet.
• 0.962629 -0.191474 -0.191527 facet normal -0.840149 -0.533182 0.0993293.
• 15x10.2mm^2 drill 1.2mm pad 3mm Terminal Block.

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