Labels Milestones
BackBump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header SMD 1x05 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x24 2.00mm single row style1 pin1 left Surface mounted socket strip THT 1x01 2.00mm single row Surface mounted socket strip SMD 2x01 1.27mm double row surface-mounted straight socket strip, 2x25, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x05, 2.00mm pitch, double rows Through hole straight pin header, 1x11, 2.54mm pitch, double rows Surface mounted pin header THT 2x02 2.54mm double row Through hole vertical IDC box header 2x07 2.54mm double row Through hole socket strip THT 2x32 1.00mm double row Through hole IDC header, 2x17, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header SMD 2x40 1.00mm double row SMD IDC box header, 2x06, 2.54mm pitch, 8.51mm socket length, double rows Through hole socket strip THT 2x16 1.27mm double row Through hole straight pin header, 2x19, 1.00mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length, 1x19, 5.08mm pitch, single row style2 pin1 right Through hole.
- For: MCV_1,5/6-G-5.08; number of pins.
- 37.5x10.3mm^2 drill 1.3mm pad.
- //} module make_surface(filename, h) .
- -0.460564 -0.643676 0.611197 vertex -6.81829.
- 0.0819649 -0.993264 vertex 3.03882 3.62229 21.7538.