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43915-xx08, With thermal vias in pads, 3 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 8 Pin (https://www.silabs.com/documents/public/data-sheets/si7210-datasheet.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B12B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, 53261-0871 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic Shrink Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see.

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