Labels Milestones
BackMicrostar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder.
- Http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System.
- (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3), generated with kicad-footprint-generator.