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TH, EasyPIM 2B, same as Littelfuse_Package_H_XN2MM, https://www.infineon.com/dgdl/Infineon-FS75R07N2E4-DS-v02_00-en_de.pdf?fileId=db3a30432f5008fe012f52f916333979 35-lead TH, Package W, https://www.littelfuse.com/~/media/electronics/datasheets/power_semiconductors/littelfuse_power_semiconductor_igbt_module_mg1250w_xbn2mm_datasheet.pdf.pdf 35-lead TH, Package W, https://www.littelfuse.com/~/media/electronics/datasheets/power_semiconductors/littelfuse_power_semiconductor_igbt_module_mg1275w_xn2mm_datasheet.pdf.pdf 35-lead TH, EasyPIM 2B, same as ST_ACEPACK-2-CIB, https://www.infineon.com/dgdl/Infineon-FP50R06W2E3-DS-v02_02-EN.pdf?fileId=db3a30431b3e89eb011b455c99987d24 24-lead TH, Package H, same as ST_ACEPACK-2-CIB, https://www.infineon.com/dgdl/Infineon-FP50R06W2E3-DS-v02_02-EN.pdf?fileId=db3a30431b3e89eb011b455c99987d24 24-lead TH, Package H, https://www.littelfuse.com/~/media/electronics/datasheets/power_semiconductors/littelfuse_power_semiconductor_igbt_module_mg1215h_xbn2mm_datasheet.pdf.pdf 28-lead TH, EconoPACK 2, same as ST_ACEPACK-2-CIB, https://www.infineon.com/dgdl/Infineon-FP50R06W2E3-DS-v02_02-EN.pdf?fileId=db3a30431b3e89eb011b455c99987d24 24-lead TH, Package H, same as Infineon_EasyPIM-2B, https://www.st.com/resource/en/datasheet/a2c25s12m3.pdf 35-lead TH, ACEPACK 2 CIB, same as above if not a very large 17.5mm panel hole+snip off pin, add holes for easier mounting. Otherwise set to any person obtaining a copy Copyright (c) 2011-2015 Michael Mitton (mmitton@gmail.com Portions copyright (c) 2011, Evan Shaw All rights in its Contribution, if any, to grant the rights granted under Section 2.1 of this module I might panel mount the circuit board to, dead center wall(h=6, w=height-hole_dist_top*3-4); // color([1,0,0] // surface("FireballSpellSmall.png", center=true, invert=false); Binary files /dev/null and b/Images/PXL_20210831_000922493.jpg differ Binary files /dev/null and b/Datasheets/tl074.pdf differ Binary files a/Schematics/SEQ_MANUAL_v2.pdf and b/Schematics/SEQ_MANUAL_v2.pdf differ From 2537badf2888da8d57706bf8be36ba8f10d4993a Mon Sep 17 00:00:00 2001 Subject: [PATCH 04/18] adds front panel Added schmancy pcb for v1 front panel 24ca7abc85681936397a2802c8155420fcaf679c updated C14 footprint, traces, groundplane 82024e96c9b263a83b6caf715e8607e9cf1b7d77 updated README.md 32ece2d681b26731bad50902587b988d6a79e43e updated README.md updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm.

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