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MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 5.25 mm (206 mils), body size 10.8x21.88mm 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.48.

• 0.0868538 -0.0464241 0.995139 vertex 1.52046 -7.64388 5.97318.
• Normal 0.346108 0.295597 0.890411 vertex 5.60951 0.191567.
• 1.417670e-15 1.433165e-16 -1.000000e+00 facet.
• Diamater 1.15mm, pad diameter 2.5mm.

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