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Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle.

• -3.2059 -8.2001 11.7816 facet normal 1.304253e-001 -2.235980e-001 9.659157e-001.
• 5.232259e+000 1.747200e+001 facet normal 0.991524 0.109219 0.0703592.
• 179.1 131.75 (end 162.85 122.845 (end 163.5 122.5.
• Clearance8mm SMD DIP DIL.

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