3
1
Back

3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 2x04 1.27mm double row surface-mounted straight pin header, 1x02, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x16, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x23 2.54mm single row style2 pin1 right Through hole angled pin header, 1x31, 1.27mm pitch, single row Through hole straight socket strip, 2x13, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header, 1x18, 1.00mm pitch, double rows Through hole angled pin header, 1x33, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 2x02, 2.00mm pitch.

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