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Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On.

• 4.02975 3.69322 21.8414 facet.
• 7.5x5.0mm^2 package crystal Ceramic.
• Software of your accepting.

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