3
1
Back

(900 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SC MOSFET Infineon PLCC, 20 pins, surface mount PLCC, 68 pins, through hole, DF11-10DP-2DSA, 5 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated with kicad-footprint-generator connector Molex Nano-Fit Power Connectors.

New Pull Request