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Sot337-1_po.pdf SSOP16: plastic shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 38 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-LC, 22 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST PH series connector, SM06B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105310-xx14, 7 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-0370 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4100, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type094_RT03503HBLU, 3 pins, diameter 3.0mm z-position of LED center 1.0mm 2 pins diameter 5.0mm z-position of LED center 3.0mm 2 pins LED, diameter 5.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 1.6mm, 2 pins, pitch 5mm, size 27.3x14mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00086 vertical pitch 3.5mm size 32.5x8.3mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 804-101, 45Degree (cable under 45degree), 3 pins, pitch 5mm, size 70x9.8mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10700.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block 4Ucon.

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