Labels Milestones
BackPackage (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP.
- Sensor, Dual-Barbed, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=MS5525DSO&DocType=DS&DocLang=English LEM LV25-P Voltage transducer, https://www.lem.com/sites/default/files/products_datasheets/lv_25-p.pdf.
- For: MC_1,5/9-G-3.5; number of pins: 05; pin pitch.