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Beam Socket Strip, HLE-112-02-xxx-DV, 12 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. 's notes on repique/caixa, two or three for surdos row_2 = row_1 + v_margin + 12; row_1 = v_margin+12; Initial stab at a 10-step panel layout ideas out_row_1 = v_margin+12; row_2 = row_1 + vertical_space/7; row_6 = row_5 + vertical_space/7; row_5 = row_4 + vertical_space/7; cv_in_1a = [left_col, row_6, 0]; cv_1b_atten = [right_col, row_6, 0]; cv_1b_atten = [right_col, row_3, 0]; cv_in_2b = [right_col, row_1, 0]; fm_in = [h_margin+working_width/8, row_2, 0]; square_out = [third_col, fourth_row, 0]; //Fifth row interface placement triangle_out = [output_column, row_2, 0]; fm_lvl = [second_col, fifth_row, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_3, 0]; manual_2 = [left_col, row_6, 0]; audio_in_1 = [left_col, row_6, 0]; audio_in_1 = [left_col, row_5, 0]; audio_out_1 = [right_col, row_5, 0.

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