Labels Milestones
Back2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads.
- 3x3mm package, pitch 0.4mm; see section 7.3.
- 1-770967-x, 3 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29.