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X 4mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf#page=15), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_QFN_9x9_MR_C04-00149e.pdf), generated with kicad-footprint-generator connector JST XH side entry Molex Micro-Fit 3.0 Connector System, 43045-0821 (alternative finishes: 43045-080x), 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2041_datasheet.pdf#page=62), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-770968-x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate side entry connector Molex Micro-Fit_3.0 vertical connector Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2010, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with pin 2 and 13 removed for voltage dividers feeding chip inputs - don't do manual connection to GND if you want. Putting everything together is a ceramic 104 power cap like C5, C6, C8, C9 | 4 Hardware/PCB/precadsr/potsetc.sch | 602 Hardware/PCB/precadsr/precadsr.cmp | 45 Hardware/PCB/precadsr/precadsr.net | 147 Hardware/PCB/precadsr/precadsr.pro | 22 Hardware/PCB/precadsr/precadsr.sch | 125 .../PCB/precadsr_Gerbers/precadsr-B_Mask.gbr | 481 .../PCB/precadsr_Gerbers/precadsr-B_Paste.gbr | 4 .../PCB/precadsr_Gerbers/precadsr-F_Paste.gbr | 15 .../PCB/precadsr_Gerbers/precadsr-F_SilkS.gbr | 128 .../PCB/precadsr_Gerbers/precadsr-NPTH.drl | 17 ...tenv_Panel_Slotted_Mounting_Hole.kicad_mod | 23 .../fastestenv_Pot_Hole.kicad_mod | 17 .../Kosmo_LED_Hole.kicad_mod | 17 ...osmo_Panel_Slotted_Mounting_Hole.kicad_mod | 23 (format (units 2) (units_format 1) (precision 4 (style (thickness 0.1) (arrow_length 1.27) (text_position_mode 0) (extension_height 0.58642) (extension_offset 0) keep_text_aligned (text "Kassu used 1 uF tantalum\nYuSynth 1, 10 µF tantalum.\nMFOS 1, 1+15 µF electrolytic.\n1 µF tanty looks better than EL\n(higher output, less leakage)\nbut only by a little. 1 uf \npolyester film looks.

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