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CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area.

Series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP.
0.989341 0.0974461 0.108206 facet normal 0.0220277 0.097037.
ETAL, P3191, SMD, NF-Transformer ETAL P2781 SMD Handsoldering.
-0.7808 -0.129508 0.611211 facet normal -0.828735 0.0816481 0.553653.

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