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For: MSTBA_2,5/15-G; number of pins: 13; pin pitch: 3.81mm; Angled || order number: 1827871 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/15-G-3.5; number of pins: 09; pin pitch: 7.50mm; Angled || order number: 1755781 12A || order number: 1843240 8A 160V Generic Phoenix Contact SPT 2.5/7-V-5.0-EX 1732548 Connector Phoenix Contact connector footprint for: MCV_1,5/5-GF-3.5; number of pins: 10; pin pitch: 5.00mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1843253 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/15-G-5,08; number of pins: 11; pin pitch: 5.08mm; Angled || order number: 1843282 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/10-GF; number of pins: 04; pin pitch: 3.81mm; Angled || order number: 1924127 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/7-GF-3.5; number of pins: 06; pin pitch: 3.81mm; Angled; threaded flange || order number: 1776508 12A || order number: 1924130 16A (HC Generic Phoenix Contact SPT 2.5/4-V-5.0-EX Terminal Block, 1991053 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991053), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5030, 3 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 43915-xx10, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm.

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