Labels Milestones
BackHLE-138-02-xxx-DV-BE, 38 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 4, Wuerth electronics 9774050482 (https://katalog.we-online.de/em/datasheet/9774050482.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Thin Quad Flatpack No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic DFN.
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