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BackPin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-LC, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, hole diameter 1.3mm, wire diameter 1.0mm test point THT pad rectangle square SMD pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 4 pin, Right Angle, Surface Mount, http://www.molex.com/pdm_docs/sd/1054440001_sd.pdf USB TYPE C, RA RCPT PCB, Hybrid, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401548E4%7e2A USB C Type-C Receptacle SMD USB 2.0.
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