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Toshiba, Toslink, TORX170, TORX173, TORX193, TORX194 Fiberoptic Reciver RX Toshiba Toslink TORX170 TORX173 TORX193 TORX194 IR Receiver Vishay TSOP-xxxx MINICAST IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82493/tsop311.pdf package for diode bridges, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole straight socket strip, 1x32, 1.27mm pitch, double rows Through hole angled pin header, 1x14, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x13 2.00mm single row Through hole angled pin header, 2x32, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7!), script generated Through hole angled pin header, 2x04, 2.54mm pitch, double rows Through hole socket strip SMD 1x16 1.00mm single row style2 pin1 right Through hole pin header THT 2x18 1.27mm double row Through hole angled pin header THT 2x03 2.00mm double row Through hole angled socket strip THT 2x11 2.00mm double row Through hole IDC header.

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