Labels Milestones
BackCPGA196 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.5mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CA), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-LC, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 5, Wuerth electronics 9774110360 (https://katalog.we-online.de/em/datasheet/9774110360.pdf), generated with kicad-footprint-generator Diode, Universal, SMB(DO-214AA) or SMC (DO-214AB), Handsoldering, Diode Universal MELF RM10 Handsoldering SMD Thruhole Diode SMC (DO-214AB) Handsoldering Diode SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, SMC (DO-214AB), Handsoldering, Diode Universal SMA (DO-214AC) SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, MELF, RM10, Handsoldering, SMD, Thruhole, Diode Universal SMB(DO-214AA) SMC (DO-214AB) RM10 Handsoldering SMD Thruhole Diode Universal SMA (DO-214AC) or SMB (DO-214AA), Handsoldering, Diode Universal SMA (DO-214AC) SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, SMB(DO-214AA) or SMC (DO-214AB), RM10, Handsoldering, SMD.
- Series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package Ultraminiature Crystal Clock.
- (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Mounting Hardware, inside.
- Electronics 97730306332 (https://katalog.we-online.com/em/datasheet/97730306332.pdf), generated with kicad-footprint-generator XP_POWER.