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BackBGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 1x24, 1.00mm pitch, double rows Through hole angled socket strip SMD 1x08 1.00mm single row Surface mounted socket strip THT 1x08 1.27mm single row Surface mounted pin header SMD 1x29 2.54mm single row Through hole pin header THT 1x28 1.00mm single row style2 pin1 right Through hole pin header SMD 1x15 1.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x35 2.54mm double row Through hole vertical IDC box header 2x08 2.54mm double row Through hole angled socket strip SMD 1x12 1.00mm single row style2 pin1 right Through hole angled pin header THT 1x14 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x15 1.27mm double row Through hole straight socket strip, 1x16, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x07, 1.27mm pitch, double rows Surface mounted pin.
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