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Electronics 9775041960 (https://katalog.we-online.com/em/datasheet/9775041960.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0144.PDF), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5020, 2 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator JST PH series connector, SM09B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 15 Circuits (https://www.molex.com/pdm_docs/sd/2005280150_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-28DP-2DSA, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0830, 8 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-V (7361-38 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20), generated with kicad-footprint-generator Inductor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0018 example for new mpn: 39-28-922x, 11 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator JST GH series connector, LY20-4P-DLT1, 2 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator JST XA series connector, B16B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FF0881SA1, 81 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 2, Wuerth electronics 9774025633 (https://katalog.we-online.com/em/datasheet/9774025633.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF), generated with kicad-footprint-generator connector JST SH series connector, B08B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator connector Molex Sabre Power Connector, 43160-0106, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 14110713010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 7, Wuerth electronics 9774050943 (https://katalog.we-online.de/em/datasheet/9774050943.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5569-08A2, example for new mpn: 39-29-4029, 1 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADXL363.pdf#page=44 MS5837 Ultra-small gel-filled pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to EWG1308/2013 10/100/1000 Base-T RJ45 single port with LEDs and 75W POE, https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/J432/doc_part/J432.pdf RJ45 8p8c ethernet cat5 1 Port RJ45 8P8C receptacle.

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