Labels Milestones
Back2.54mm IIPAK I2PAK TO-262-5, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 2.54mm TO-247-5, Horizontal, RM 2.286mm SIPAK Horizontal RM 4.58mm IPAK TO-251-2, Vertical, RM 2.54mm TO-220-4 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-9, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-9 Horizontal RM 5.08mm TO-126-2, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-7, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 2.54mm staggered type-2 TO-220-9 Horizontal RM 4.58mm IPAK TO-251-2, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes TO-46-3, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Shrink Small Outline (SS)-5.30 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm.
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