synth_tools

Back

0.9mm staggered type-2 TO-220F-7, Vertical, RM 0.9mm, staggered type-2 TO-220F-7 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 2.54mm, staggered type-1 TO-220F-5, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 2.54mm TO-220-4, Vertical, RM 2.286mm SIPAK Horizontal RM 2.54mm TO-251-2, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for Kodenshi SG-105 with PCB locator, 9 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad LQFP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc0015.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://www.ti.com/lit/ds/symlink/tusb8041.pdf#page=42), generated with kicad-footprint-generator JST ZE series connector, 502386-0270 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Hirose.

New Pull Request

Labels Milestones