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121.92 119.38 "Notes": "Layer F.Mask" "Notes": "Layer F.Paste" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes Total unplated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/PCB/precadsr/precadsr.sch Normal file View File Images/precadsr-panel-art.png Normal file Unescape Schematics/Unseen Servant/Unseen Servant_slider_board_noncanonical.kicad_prl Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/CP_Radial_D5.0mm_P2.00mm.kicad_mod Normal file View File Images/PXL_20210831_000949090.jpg Normal file Unescape Panels/10_step_seq_38hp_v3.scad Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x02_P2.54mm_Vertical.kicad_mod Normal file View File Panels/label_test.stl Normal file Unescape 3D Printing/Cases/Eurorack 2-Row/rail_profile.scad Executable file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Female.png Executable file View File From 4049c4aafe61a54c756e746df9f3a582c255b776 Mon Sep 17 00:00:00 2001 Subject: [PATCH] adds README.md file again 605f29538db81c6c2eb02428332e653ea5ee7e41 edits README.md file 666c48f795 adds README.md file - Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack - Confirm barrel power jack - Confirm barrel power jack 2mm 2.5mm KLDX-0202-BC KLDX-0202-AC 1.10mm Pitch microSD Memory Card Connector, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0200, 20 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [QFN] with thermal vias in pads, 6 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105310-xx08, 4 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV-BE, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 8.6, Wuerth electronics 97730506330 (https://katalog.we-online.com/em/datasheet/97730506330.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 52 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times 1 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0.

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