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Spacing 8.89 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL ZIF 25.4mm 1000mil Socket 3M 28-pin zero insertion force.

• TDK, SLF12565, 12.5mmx12.5mm (Script generated with kicad-footprint-generator.
• 171113 bytes Schematics/Luthers_VCO_schematic.pdf | Bin 0 -> 445539.
• Mount, http://www.molex.com/pdm_docs/sd/1054440001_sd.pdf USB TYPE C, USB 2.0, SMT.
• 7.51042 6.0001 facet normal 0.772847 -0.634593 -1.35691e-05.

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