Labels Milestones
BackHttps://www.nexperia.com/packages/SOD962-2.html Diode SMPA (DO-221BC), https://www.vishay.com/docs/87659/v8pa10.pdf Single phase, Bridge Rectifier, 28.55x28.55mm, case KBPC_W(WP), https://www.diodemodule.com/bridge-rectifier/kbpc/kbpc15005w.pdf 128x32 LCD with RGB backlight https://www.newhavendisplay.com/specs/NHD-C12832A1Z-FSRGB-FBW-3V.pdf EPCOS/TDK Electronics/Qualcomm DCC6c SAW filter package - 1.4x1.1 mm Body; (see https://global.kyocera.com/prdct/electro/product/pdf/sf14_tdlte.pdf 0.5A, 250VAC, 50/60Hz line filter (https://filtercon.com.pl/wp-content/uploads/2019/07/Karta-katalogowa-FP-12-1.pdf Mini-Circuits Filter SMD 1206 https://ww2.minicircuits.com/case_style/FV1206-7.pdf SMD Type 10.7MHz Ceramic Filter https://www.murata.com/en-us/products/filter/cerafil/sfecf 6-pin 3.8 x 3.8mm SAW filter package, https://www.golledge.com/media/3785/mp08167.pdf 8-pin 3.8x3.8mm SAW filter, https://www.golledge.com/media/1831/ma05497.pdf Compact PCB mounting EMI filter (https://www.schaffner.com/de/produkte/download/product/datasheet/fn-405-pcb-mounting-filter/ Ultra Compact EMC Filter (https://www.schaffner.com/products/download/product/datasheet/fn-406-ultra-compact-emc-filter/ Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-24DP-2DSA, 12 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AB), generated with kicad-footprint-generator JST SHL series connector, B3B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 1.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, 2.05 inner diameter 2.05mm or 2.55mm depending on which the stem radius adapts at the first if(preg_match("@.*(