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Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x34, 2.00mm pitch, single row Surface mounted pin header SMD 2x29.

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