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CASE 506BU-01 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked.

• Of base of round part.
• Type171_RT13706HBWC pitch 7.5mm size 24.8x14mm^2 drill.

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