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DFN8 2x2, 0.5P; CASE 506CM (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.8mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x32 1.00mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x16 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x20 2.54mm single row Surface mounted pin header THT 2x22 1.27mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x10, 5.08mm pitch, single row Through hole angled socket strip, 1x13, 2.54mm pitch, single row Surface mounted socket strip THT 2x34 1.00mm double row Through hole socket strip THT 1x33 2.54mm single row Surface mounted pin header THT 1x35 1.27mm single row Through hole straight pin header, 2x18, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x40 1.27mm double row Through hole angled socket strip SMD 2x33 2.00mm double row Through hole IDC header, 2x32, 2.54mm pitch, double rows Through hole pin header THT 1x21 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x04 2.00mm single row style2 pin1 right Through hole angled pin header SMD 2x18 1.27mm double row surface-mounted straight pin header, 2x10, 2.54mm pitch, single row Surface mounted socket strip THT 2x08 2.54mm double row Through hole straight socket strip, 2x08, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x32 1.00mm single row Surface mounted pin header SMD 1x19 2.00mm single row style2 pin1 right Through hole angled pin header SMD 1x24 2.00mm single row Surface mounted socket strip THT 1x32 1.27mm single row Through hole straight.

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