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Back05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (https://www.semtech.com/uploads/documents/sx1272.pdf#page=125), generated with kicad-footprint-generator Mounting.
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