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BackBytes .../Panels/POLYMORPH.png | Bin 0 -> 36336 bytes create mode 100644 Panels/label_test.stl create mode 100644 Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-F_Mask.gbr create mode 100644 README.md create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr create mode 100644 SR 1.pdf | Bin 0 -> 580484 bytes .../Panels/Radio_shaek_standoff_padded_2.stl | Bin 0 -> 147621 bytes Images/loop.png | Bin 0 -> 12724 bytes .../Panels/POLYMORPH.png | Bin 0 -> 328607 bytes Images/PXL_20210831_001017829.jpg | Bin 0 -> 104908 bytes Panels/title_test.scad | 22 Panels/title_test.stl | Bin 0 -> 38764 bytes Panels/futura light bt.ttf differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin' 6298fd8aa3 Gunnerkrigg and cleanup of alt-tag-only sites 2015-03-24 12:20:47 -07:00 55ee65a5e9 Go to file db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill Find and replace last few thin traces, fix teardrops and gnd fill db7d02719b68f4d2f81a25d8b6527257f18cc3a1 Embiggen traces, add teardrops 46614f2341 Add 55k-ish resistor to coarse knob to fix tuning range Add 55k-ish resistor to coarse knob to fix tuning range updates the potentiometer pads and thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4x4mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch.
- -9.129413e+01 1.027282e+02 1.055000e+01 vertex -9.539322e+01.
- -1.000000e+00 9.555517e-13 vertex -1.053395e+02 9.665134e+01 1.051169e+01 facet normal.
- Strip, HLE-108-02-xxx-DV-BE-LC, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- 0.844851 -0.256282 0.469623 vertex 3.40084 8.21035.
- THIS DOCUMENT DOES NOT PROVIDE this CC0 or.