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42-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 24.13mm.

• Card connector, top mount, SMT (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F2041021%7FB%7Fpdf%7FEnglish%7FENG_CD_2041021_B_C_2041021_B.pdf%7F2041021-4.
• 4. You may do.
• 7.60514 vertex -7.2327 0.99264 7.55007 vertex -4.46475.
• RND 205-00287, 2 pins, diameter 3.0mm.

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