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BackCPG238 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight Samtec HPM power header series 11.94mm post length, 1x08, 5.08mm pitch, single row style2 pin1 right Through hole straight socket strip, 2x17, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled pin header, 1x22, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header THT 2x26 1.27mm double row Through hole straight socket strip, 2x26, 1.27mm pitch, double rows Surface mounted pin header THT 2x18 2.00mm double row Through hole angled pin header, 2x40, 1.27mm pitch, 4.4mm socket length, single row Surface mounted socket strip SMD 1x34 2.54mm single row Through hole angled pin header, 2x39, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows.
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