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Strip, HLE-137-02-xx-DV-PE-LC, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0009 example for new part number: A-41792-0011 example for new part number: 22-27-2141, 14 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV-A, 19 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12858&prodName=TLP291-4), generated with kicad-footprint-generator JST J2100 vertical JST EH series connector, B3B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 56 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 22.86 mm (900 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 8.61 mm.

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