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SMD pad as test point, loop diameter 3.8mm, hole diameter 1.5mm THT pad as test Point, square 4.0mm side length, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test Point, square 2.0mm side length SMD rectangular pad as test point, pitch 7.62mm, hole diameter 1.85mm wire loop wire loop bead wire loop as test Point, diameter 4.0mm Plated Hole as test point, loop diameter2.6mm, hole diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST GH series connector, LY20-12P-DLT1, 6 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5170, 17 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Hirose series connector, BM14B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-10A example for new part number: 26-60-4100, 10 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-08A, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 72 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001682C.pdf#page=70), generated with kicad-footprint-generator JST J2100 series.

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