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LongPads 24-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78S-0.1, SIP-4, pitch 2.54mm, hole diameter 1.5mm THT pad rectangle square THT rectangular pad as test point, loop diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00298_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00013 pitch 5mm size 25x9mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type055_RT01504HDWU, 4 pins, pitch 7.5mm.

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