Labels Milestones
Back0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 324 0.8 CSGA324.
- Gnd fill Corrected: Shifted.
- 205-00087, vertical (cable from top), 8 pins, pitch.
- Contributors Based on https://github.com/oguzbilgic/fpd, which has broken alt.
- 35.6x11.2mm^2 drill 1.3mm pad.