Labels Milestones
Back8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x05, 1.27mm pitch, double rows Through hole angled pin header, 1x07, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x01, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x10, 1.27mm pitch, 4.4mm socket length, single row Surface mounted pin header SMD 2x07 1.00mm double row Through hole angled pin header THT 2x03 2.54mm double row surface-mounted straight pin header, 2x09, 1.00mm pitch, double.
- Length*width=29*7.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series.
- R6, R7 | 3.