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BackPin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3.5mm, size 39.2x7mm^2, drill diamater 1.4mm, pad diameter 2.4mm, outer diameter 3.9mm, size.
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