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(area) array, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x11 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x22 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x20 1.00mm double row Through hole angled socket strip SMD 1x07 1.00mm single row Through hole angled pin header, 2x05, 2.54mm pitch, single row Through hole socket strip THT 2x10 2.54mm double row Through hole straight pin header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x12, 2.00mm pitch, 4.2mm pin length, single row Through hole socket strip SMD 1x34 2.00mm single row Surface mounted pin header THT 1x11 2.00mm single row style2 pin1 right Through hole horizontal IDC header THT 2x21 1.27mm double row Through hole straight socket strip, 1x02, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header, 1x24, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled pin header, 2x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole Samtec.

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