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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/3555fe.pdf#page=32), generated with kicad-footprint-generator JST PH series connector, S2B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Pico-Lock series connector, BM07B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-40S-0.5SH, 40 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B18B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 7.6, Wuerth electronics 9774050482 (https://katalog.we-online.de/em/datasheet/9774050482.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-153 Var EC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose BM24 series connector, 202396-1007 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 84 pins, through hole 3.3mm, height 12, Wuerth electronics 9774150960 (https://katalog.we-online.de/em/datasheet/9774150960.pdf,), generated with kicad-footprint-generator Molex Pico-Lock series connector, 502443-0270 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-BE-LC, 48 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.127 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.25 mm² wire, reinforced insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator JST SUR series connector, BM07B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter.

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