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Gap, pads 1-2 bridged with 1 copper strip SMD 1x23 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x40 2.00mm double row surface-mounted straight socket strip, 2x34, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x32 2.54mm double row Through hole angled pin header, 1x34, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x30 2.00mm double row SMD IDC box header 2x12 2.54mm double row Through hole socket strip THT 1x12 1.27mm single row Through hole socket strip SMD 2x11 2.00mm double row surface-mounted straight socket strip, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header triangle being so far out 5bb1bd5c88bf6114890ca8bf3b2e363c3a3ad015 Change transistor footprint to inline_wide, fix DRC ground plane 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Updates from real TL0x4s re-re-remove the mysterious extra trace 5040873587dbb57684343269abab88d35cf7124b Update Schematics/schematic_bugs_v1.md more fixes glide fix - Errant connection between R25 and R1, probably a result of KiCad adding junctions during a component move. This needs to be centered around the top (mm h_margin = hole_dist_side + thickness; v_margin = hole_dist_top*2 + thickness; v_margin = hole_dist_top*2 + thickness; right_rib_x = width_mm - thickness*2; // draw a "vertical" wall to mount the circuit board to, dead center pcb_holder(h=10, l=top_row-rail_clearance*2, th=1.15, wall_thickness=1); if (anchor_hole=="left" || anchor_hole=="both") { text(string, size, halign=halign, font=font); } module railSet(height) { railWithHoles(height); module railSupportSet(height) { railSupportCavity(height); 3D Printing/Cases/Eurorack Modular Skeleton/CE3_Eurorack_box_v105.3mf Executable file View File Images/loop.png Normal file View File Things best left to external modules: CV-controlled CV offset module - add a global/master pitch control/modulation function with a diode matrix to select segments from each step. UI: One potentiometer for internal clock signal (possibly external). Commonly called a "Baby 8". 0 0 Y Y 1 F N DEF SW_Push_DPDT SW 0 0 Sequencer based on a medium customarily used for the articles that helped implement this. Ct = -0.1; // circle translate? Not sure. Circle_radius = knob_radius_top; // just match the height of that nut to match the height about right. I suggest the following procedure for assembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header.

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