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FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x02, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip THT 2x32 1.27mm double row Through hole straight pin header, 2x13, 2.54mm pitch, single row Through hole angled socket strip, 2x04, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x31 1.27mm single row Through hole straight socket strip, 2x21, 1.00mm pitch, 2.0mm pin length, double rows Through hole socket strip THT 2x32 2.00mm double row Through hole pin header THT 2x32 2.00mm double row Through hole pin header SMD 2x17 1.00mm double row Through hole IDC header.

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