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2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 2x09, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header THT 1x02 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x31 2.54mm single row Through hole pin header THT 1x10 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x30, 1.00mm pitch, 2.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x39, 2.54mm pitch, double rows Surface mounted pin header THT 1x10 2.00mm single row style2 pin1 right Through hole angled socket strip, 2x33, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x03 1.27mm single row Through hole pin header THT 1x05 2.54mm single row Through hole socket strip SMD 1x15 1.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x25, 2.54mm pitch, double rows Through hole angled pin header THT 1x38 2.00mm single row style2 pin1 right Through hole socket strip THT 1x22 1.00mm single row Through hole straight socket strip, 1x21, 2.54mm pitch, DIN 41651 / IEC 60603-13.

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