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Ball 3x3 area grid, NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD.

• -5.35951e-05 0.995039 vertex 8.00491 0 19.9509 vertex.
• 3.99693 -8.86128 3.26879 facet normal 9.953861e-01 3.522494e-14 -9.595103e-02.
• -8.966089e-01 -4.428233e-01 3.031262e-04 vertex -9.102618e+01.
• Box pin pitch 23.90mm.
• Http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ TO-263/D2PAK/DDPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3.

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